Competitive Advantage

The major competitors in this field include the following:

1. Multi-SOI wafer provider (SOITEC, CEA-LETI)
2. Thick film SOI MEMS design and production (Tronics, Kulite, Thales, EADS, CEA-LETI,);
3. Thin film SOI IC design house (CISSOID)
4. Packaging / System Houses (TRW, Kistler)
5. Multi-physics/dimensions simulations of mechanical structures (CENAERO).

The primary competitive advantage and the barrier-to-entry will be determined by the exact nature of intellectual property and product development knowledge resident in the UCL-ITE collaboration. UCL has managed several successful SOI-based collaborations in the past. Examples incude:

• Thin film SOI IC fabrication (UCL, X-FAB, DALSA, Honeywell, ITE)
• Gas SOI and SiC sensors (UCL, EADS, TUB, Sochinor)
• Thin film SOI MEMS/sensors design and fabrication (UCL, X-FAB, IMS, DALSA, Honeywell, ITE)