Pilot Project Implementation Schedule

It is expected that the first project phase aiming at the technology transfer completion (steps 1 – 4) will take about 20 months after the contract signature.
Steps 5 – 7 may partly overlap with steps 1 -  4 beginning at month 12 and being completed at month 30.
Steps  8 – 10 may be undertaken after completing task 7 and should last till month 42.
Simultaneously a number of demonstrators will be defined together with interested Caneus Partners.
The SOI technology transfer  should thus be viewed as an enabling technology or platform that can address industrial needs for harsh environment MNT.
The phase 1 will be executed in cooperation between UCL and ITE.

Phase 2

The prototype identification will be defined during the Caneus 2006 Workshop. The development of demonstrators can start at UCL simultaneously with the phase 1 of the Project (see above). In the second phase, these demonstrators will be transferred to ITE to show feasibility of the industrial IC fabrication. If complementary technologies are identified in Toulouse then adequate providers will be invited to the Project. The technology provider capable and interested in extension of the small scale production into the high volume, once such need would appear as economically justified, will be selected and letter of intent signed with UCL and ITE.
It has to be noted also, that this project does not cover the packaging issue. The packaging for harsh environment application is a separate complex subject matter which has to be well matched to specific MEMS/Sensor product. Thus,  it is assumed, that appropriate, carefully selected partner(s) having a deep expertise in packaging for harsh environment application will be chosen within the first phase of the project and will join the consortium or will provide a commercial services for the individual consortium members as subcontractor in the second phase where specific demonstrator products will be decided.
Examples considered in the Project Proposal include: MNTs for structural and aerodynamics monitoring (i.e. accelerometers, temperature, pressure and flow sensors existing on SOI, as well as the potentiality to realize their control electronics for harsh environments); MNT for engine or energy distribution control; MNT for cabin control (adding to the previous achievements, polymer above ICs for humidity and fire sensors, as well as the Ultra-Low-Power read-out electronics).
Furthermore, MNT with wireless communication and miniaturized or autonomous power sources can be considered since SOI can incorporate both high-performance wireless and power management electronics. However to date, such arrays of multiple sensors and their associated circuits have not been co-integrated in industrial-level technologies and products.
Examples of the applications based on the use of the FD SOI technology mastered by UCL now  and ITE in a short future, respectively,  are given in the chapter 4.
UCL and ITE will focus on jointly developing the prototype SOI-based harsh environment sensor based on the selection of an appropriate sensor application. Depending on demand, a possible application could be MNT sensors for engine or energy distribution control.